Timing Analysis beyond Complementary CMOS Logic Styles
J. Lappas, A. Riahi, C. Weis, N. Wehn, S. Nassif. 29th Asia and South Pacific Design Automation Conference (ASP-DAC), Januar, 2024, Incheon Songdo , South Korea

The NWRD Dataset: An Open-Source Annotated Segmentation Dataset of Diseased Wheat Crop
H.Anwar, S.U.Khan, M.M.Ghaffar, M.Fayyaz, M.J.Khan, C. Weis, N. Wehn, F. Shafait. Sensors, Special Issue: Deep Learning for Semantic Segmentation and Explainable AI Based on Sensing Technology,  August,2023.

ZuSE-KI-AVF: Application-Specific AI Processor for Intelligent Sensor Signal Processing in Autonomous Driving
G. B. Thieu, S. Gesper, G. Payá-Vayá, C. Riggers, O. Renke, T. Fiedler, J. Marten, T. Stuckenberg, H. Blume, C. Weis, L. Steiner, C. Sudarshan, N. Wehn, L. M. Reimann, R. Leupers, M. Beyer, D. Köhler, A. Jauch, J. M. Borrmann, S. Jaberansari, T. Berthold, M. Blawat, M. Kock, G. Schewior, J. Benndorf, F. Kautz, H.-M. Bluethgen, C. Sauer. IEEE Conference Design, Automation and Test in Europe (DATE), March, 2023, Antwerp, Belgium.

Investigation of Pass Transistor Logic in a 12nm FinFET CMOS Technology
A. Chinazzo, J. Lappas, C. Weis, Q. Huang, Z. Wu, L. Ni, N. Wehn. IEEE International Conference on Electronics Circuits and Systems (ICECS 2022), October, 2022, Glasgow, UK.

FeFET versus DRAM based PIM Architectures: A Comparative Study
C. Sudarshan, T. Soliman, T. Kampfe, C. Weis, N. Wehn. IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC), October, 2022, Patras, Greece.

A Critical Assessment of DRAM-PIM Architectures - Trends, Challenges and Solutions
C. Sudarshan, M. H. Sadi, L. Steiner, C. Weis, N. Wehn. International Conference on Embedded Computer Systems: Architectures, Modeling and Simulation (SAMOS XXII), July, 2022, Samos Island, Greece.

A Weighted Current Summation based Mixed Signal DRAM-PIM Architecture for Deep Neural Network Inference
C. Sudarshan, T. Soliman, J. Lappas, C. Weis, M. H. Sadi, M. Jung, A. Guntoro, N. Wehn. IEEE Journal on Emerging and Selected Topics in Circuits and Systems, Special Issue "Revolution of AI and Machine Learning with Processing-in-Memory (PIM): from Systems, Architectures, to Circuits", June, 2022.

Machine learning based soft error rate estimation of pass transistor logic in high-speed communication
Z. Zhang, J. Lappas, A. Chinazzo, C. Weis, Z. Wu, L. Ni, N. Wehn, M. Tahoori. 27th IEEE European Test Symposium, May, 2022, Barcelona, Spain.

Optimization of DRAM based PIM Architecture for Energy-Efficient Deep Neural Network Training
C. Sudarshan, M. H. Sadi, C. Weis, N. Wehn. IEEE International Symposium on Circuits and Systems (ISCAS), May, 2022, Austin, TX, USA.

Revisiting Pass-Transistor Logic Styles in a 12nm FinFET Technology Node
J. Lappas, A. Chinazzo, C. Weis, C. Xia, Z. Wu, L. Ni, N. Wehn. Design, Automation and Test in Europe Conference 2022 (DATE 22), March, 2022, Antwerp, Belgium.

QuantYOLO: A High-Throughput and Power-Efficient Object Detection Network for Resource and Power Constrained UAVs
M. G. Javed, M. Raza, M. M. Ghaffar , C. Weis, F. Shafait, N. Wehn , M. Shahzad. IEEE International Conference on Digital Image Computing: Techniques and Applications (DICTA2021), November, 2021, Gold Coast, QLD, Australia.

Burnt Forest Estimation from Sentinel-2 Imagery of Australia using Unsupervised Deep Learning
N. Abid, M. I. Malik, M. Shahzad, F. Shafait, H. Ali, M. M. Ghaffar, C. Weis, N. Wehn. IEEE International Conference on Digital Image Computing: Techniques and Applications (DICTA2021), November, 2021, Gold Coast, QLD, Australia.

Online Working Set Change Detection with Constant Complexity
G. Vasan, É. F. Zulian, C. Weis, M. Jung, N. Wehn. ACM/IEEE International Symposium on Memory Systems (MEMSYS 2021), October, 2021, Washington, DC, USA.

AI-ForestWatch: Semantic Segmentation based End-to-End Framework for Forest Estimation and Change Detection Using Multi-Spectral Remote Sensing Imagery
A. Zulfiqar, M. M. Ghaffar, M. Shahzad, C. Weis, M. I. Malik, F. Shafait, N. Wehn. Journal of Applied Remote Sensing, Volume 15, Issue 2, 2021.
Link

Longevity of Commodity DRAMs in Harsh Environments through Thermoelectric Cooling
D. M. Mathew, H. Kattan, C. Weis, J. Henkel, N. Wehn, H. Amrouch. IEEE Access, Volume 8, Pages 83950-83962, May, 2021.
Link

A Novel DRAM Architecture for Improved Bandwidth Utilization and Latency Reduction Using Dual-Page Operation
C. Sudarshan, L. Steiner, M. Jung, J. Lappas, C. Weis, N. Wehn. IEEE International Symposium on Circuits and Systems (ISCAS), May, 2021, Daegu, South Korea. Published in: IEEE Transactions on Circuits and Systems II: Express Briefs (Volume: 68, Issue: 5, May 2021).

A Novel DRAM-Based Process-in-Memory Architecture and its Implementation for CNNs
C. Sudarshan, T. Soliman, C. De la Parra, C. Weis, L. Ecco, M. Jung, N. Wehn, A. Guntoro. 26th Asia and South Pacific Design Automation Conference (ASP-DAC), January, 2021, virtual conference.

Design of Efficient, Dependable SoCs Based on a Cross-Layer-Reliability Approach with Emphasis on Wireless Communication as Application and DRAM Memories
C. Weis, C. Gimmler-Dumont, M. Jung, N. Wehn. In: J. Henkel, N. Dutt (eds) Dependable Embedded Systems. Embedded Systems. Springer, Cham. pp 435-455, December, 2020.
Link

RAP Model—Enabling Cross-Layer Analysis and Optimization for System-on-Chip Resilience
A. Herkersdorf, M. Engel, M. Glaß, J. Henkel, V. B. Kleeberger, J. M. Kühn, P. Marwedel, D. Mueller-Gritschneder, S. R. Nassif, S. Rehman, W. Rosenstiel, U. Schlichtmann, M. Shafique, J. Teich, N. Wehn, C. Weis. In: J. Henkel, N. Dutt (eds) Dependable Embedded Systems. Embedded Systems. Springer, Cham. pp 1-27 , December, 2020.
Link

Efficient Generation of Application Specific Memory Controllers
M. V. Natale, M. Jung, K. Kraft, F. Lauer, J. Feldmann, C. Sudarshan, C. Weis, S. O. Krumke, N. Wehn. ACM/IEEE International Symposium on Memory Systems (MEMSYS 2020), October, 2020, virtual conference.

Multi-Valued Physical Unclonable Functions based on Dynamic Random Access Memory
S. Müelich, C. Sudarshan, C. Weis, M. Bossert, R. F. H. Fischer, N. Wehn. ACM/IEEE International Symposium on Memory Systems (MEMSYS 2020), October, 2020, virtual conference.

An Energy Efficient 3D-Heterogeneous Main Memory Architecture for Mobile Devices
D. M. Mathew, F. S. Prado, É. F. Zulian, C. Weis, M. M. Ghaffar, M. Jung, N. Wehn. ACM/IEEE International Symposium on Memory Systems (MEMSYS 2020), October, 2020, virtual conference.

An In-DRAM Architecture for Quantized CNNs using Fast Winograd Convolutions
M. M. Ghaffar, C. Sudarshan, C. Weis, M. Jung, N. Wehn. ACM/IEEE International Symposium on Memory Systems (MEMSYS 2020), October, 2020, virtual conference.

The gem5 Simulator: Version 20.0+ A new era for the open-source computer architecture simulator
J. Lowe-Power, A. M. Ahmad, A. Akram, M. Alian, R. Amslinger, M. Andreozzi, A. Armejach, N. Asmussen, S. Bharadwaj, G. Black, G. Bloom, B. R. Bruce, D. R. Carvalho, J. Castrillon, L. Chen, N. Derumigny, S. Diestelhorst, W. Elsasser, M. Fariborz, A. Farmahini-Farahani, P. Fotouhi, R. Gambord, J. Gandhi, D. Gope, T. Grass, B. Hanindhito, A. Hansson, S. Haria, A. Harris, T. Hayes, A. Herrera, M. Horsnell, S. A. R. Jafri, R. Jagtap, H. Jang, R. Jeyapaul, T. M. Jones, M. Jung, S. Kannoth, H. Khaleghzadeh, Y. Kodama, T. Krishna, T. Marinelli, C. Menard, A. Mondelli, T. Mück, O. Naji, K. Nathella, H. Nguyen, N. Nikoleris, L. E. Olson, M. Orr, B. Pham, P. Prieto, T. Reddy, A. Roelke, M. Samani, A. Sandberg, J. Setoain, B. Shingarov, M. D. Sinclair, T. Ta, R. Thakur, G. Travaglini, M. Upton, N. Vaish, I. Vougioukas, Z. Wang, N. Wehn, C. Weis, D. A. Wood, H. Yoon, É. F. Zulian. arXiv Preprint, July, 2020.
Link

Efficient Hardware Architectures for 1D- and MD-LSTM Networks
V. Rybalkin, C. Sudarshan, C. Weis, J. Lappas, N. Wehn, L. Cheng. Springer "Journal of Signal Processing Systems", 2020.
Link

eBrainII: A 3 kW Realtime Custom 3D DRAM integrated ASIC implementation of a Biologically Plausible Model of a Human Scale Cortex
D. Stathis, C. Sudarshan, Y. Yang, M. Jung, S. Asad, M. H. Jafri, C. Weis, A. Hemani, A. Lansner, N. Wehn. Springer "Journal of Signal Processing Systems", 2020.
Link

The Dynamic Random Access Memory Challenge in Embedded Computing Systems
M. Jung, C. Weis, N. Wehn. Book chapter in Jian-Jia Chen (Eds.), A Journey of Embedded and Cyber-Physical Systems, July, 2020, Springer.

Real-Time Energy Efficient Hand Pose Estimation: Case Study
R. Al Koutayni, V. Rybalkin, J. Malik, A. Elhayek, C. Weis, G. Reis, N. Wehn, D. Stricker. Sensors Journal, Volume 20, Issue 10, May, 2020.

Access-Aware Per-Bank DRAM Refresh for Reduced DRAM Refresh Overhead
É. F. Zulian, C. Weis, N. Wehn. IEEE International Symposium on Circuits & Systems (ISCAS), Poster Session Digital Circuit for Machine Learning & Emerging Memory Circuits, May, 2020, Seville, Spain.

System Simulation with PULP Virtual Platform and SystemC
É. F. Zulian, G. Haugou, C. Weis, M. Jung, N. Wehn. International Conference on High-Performance and Embedded Architectures and Compilers (HiPEAC), Workshop on Rapid Simulation and Performance Evaluation: Methods and Tools (RAPIDO), January, 2020, Bologna, Italy.

Channel Models for Physical Unclonable Functions based on DRAM Retention Measurements
S. Müelich, S. Bitzer, C. Sudarshan, C. Weis, N. Wehn, M. Bossert, R. F. H. Fischer. XVI International Symposium "Problems of Redundancy in Information and Control Systems" (REDUNDANCY), October, 2019, Moscow, Russia.

Fast Validation of DRAM Protocols with Timed Petri Nets
M. Jung, K. Kraft, T. Soliman, C. Sudarshan, C. Weis, N. Wehn. ACM International Symposium on Memory Systems (MEMSYS 2019), October, 2019, Washington, DC, USA.
Best Paper Award

A Lean, Low Power, Low Latency DRAM Memory Controller for Transprecision Computing
C. Sudarshan, J. Lappas, C. Weis, D. M. Mathew, M. Jung, N. Wehn. International Conference on Embedded Computer Systems: Architectures, Modeling, and Simulation (SAMOS), July, 2019, Samos Island, Greece.

RRAMSpec: A Design Space Exploration Framework for High Density Resistive RAM
D. M. Mathew, A. Chinazzo, C. Weis, M. Jung, B. Giraud, P. Vivet, A. Levisse, N. Wehn. IEEE International Conference on Embedded Computer Systems Architectures Modeling and Simulation (SAMOS), July, 2019, Samos Island, Greece.

An In-DRAM Neural Network Processing Engine
C. Sudarshan, J. Lappas, M. M. Ghaffar, V. Rybalkin, C. Weis, M. Jung, N. Wehn. IEEE International Symposium on Circuits and Systems (ISCAS), May, 2019, Sapporo, Japan.

3D Memories
C. Weis, M. Jung, N. Wehn. Book chapter in the Handbook of 3D Integration Vol 4, Wiley-VCH, 2019.
Link

Driving Into the Memory Wall: The Role of Memory for Advanced Driver Assistance Systems and Autonomous Driving
M. Jung, S. A. McKee, C. Sudarshan, C. Dropmann, C. Weis, N. Wehn. ACM International Symposium on Memory Systems (MEMSYS 2018), October, 2018, Washington, DC, USA.

Efficient Coding Scheme for DDR4 Memory Subsystems
K. Kraft, D. M. Mathew, C. Sudarshan, M. Jung, C. Weis, N. Wehn, F. Longnos. ACM International Symposium on Memory Systems (MEMSYS 2018), October, 2018, Washington, DC, USA.
Best Paper Award

A Reconfigurable Accelerator for Morphological Operations
M. Tekleyohannes, C. Weis, Norbert Wehn, M. Klein, M. Siegrist. IEEE International Parallel and Distributed Processing Symposium Workshops (IPDPSW)(RAW2018), May, 2018, Vancouver, Canada.

A Platform for Analyzing DDR3 and DDR4 DRAMs
M. Jung, D. M. Mathew, C. Rheinländer, C. Weis, N. Wehn. IEEE International Symposium on Circuits and Systems (ISCAS), May, 2018, Florence, Italy.

The Role of Memories in Transprecision Computing
C. Weis, M. Jung, É. F. Zulian, C. Sudarshan, D. M. Mathew, N. Wehn. IEEE International Symposium on Circuits and Systems (ISCAS), May, 2018, Florence, Italy.

Improving the Error Behavior of DRAM by Exploiting its Z-Channel Property
K. Kraft, M. Jung, C. Sudarshan, D. M. Mathew, C. Weis, N. Wehn. IEEE Conference Design, Automation and Test in Europe (DATE), March, 2018, Dresden, Germany.

An Analysis on Retention Error Behavior and Power Consumption of Recent DDR4 DRAMs
D. M. Mathew, M. Schultheis, C. Rheinländer, C. Sudarshan, M. Jung, C. Weis, N. Wehn. IEEE Conference Design, Automation and Test in Europe (DATE), March, 2018, Dresden, Germany.

A Memory Centric Architecture of the Link Assessment Algorithm in Large Graphs
C. Brugger, V. Grigorovici, M. Jung, C. De Schryver, C. Weis, N. Wehn, K. Zweig. IEEE Design & Test Volume 35 Number 1, January/February 2018, pp. 7–15.

Using Run-Time Reverse-Engineering to Optimize DRAM Refresh
D. M. Mathew, É. F. Zulian, M. Jung, K. Kraft, C. Weis, B. Jacob, N. Wehn. International Symposium on Memory Systems (MEMSYS 2017), October, 2017, Washington, DC, USA.

Integrating DRAM Power-Down Modes in gem5 and Quantifying their Impact
R. Jagtap, M. Jung, W. Elsasser, C. Weis, A. Hansson, N. Wehn. International Symposium on Memory Systems (MEMSYS 2017), October, 2017, Washington, DC, USA.

A Platform to Analyze DDR3 DRAM’s Power and Retention Time
M. Jung, D. M. Mathew, C. Rheinländer, C. Weis, N. Wehn. IEEE Design & Test, July, 2017.
Link

3D-Stacked Many-Core Architecture for Biological Sequence Analysis Problems
P. Liu, A. Hemani, K. Paul, C. Weis, M. Jung, N. Wehn. International Journal of Parallel Programming (IJPP), Springer, April, 2017.

An Advanced Embedded Architecture for Connected Component Analysis in Industrial Applications
M. Tekleyohannes, M. Sadri, M. Klein, M. Siegrist, C. Weis, N. Wehn. IEEE Conference Design, Automation and Test in Europe (DATE), March, 2017, Lausanne, Switzerland.

A Bank-Wise DRAM Power Model for System Simulations
D. M. Mathew, É. F. Zulian, S. Kannoth, M. Jung, C. Weis, N. Wehn. International Conference on High-Performance and Embedded Architectures and Compilers 2017 (HiPEAC), Workshop on: Rapid Simulation and Performance Evaluation: Methods and Tools (RAPIDO), January, 2017, Stockholm, Sweden.

A Customized Many-Core Hardware Acceleration Platform for Short Read Mapping Problems Using Distributed Memory Interface with 3D-stacked Architecture
P. Liu, A. Hemani, K. Paul, C. Weis, M. Jung, N. Wehn. Journal of Signal Processing Systems, Springer, 2016.
Link

DRAMSpec: A High-Level DRAM Timing, Power and Area Exploration Tool
C. Weis, A. Mutaal, O. Naji, M. Jung, A. Hansson, N. Wehn. International Journal of Parallel Programming (IJPP), Springer, 2016.
Link

ConGen: An Application Specific DRAM Memory Controller Generator
M. Jung, I. Heinrich, M. Natale, D. M. Mathew, C. Weis, S. Krumke, N. Wehn. International Symposium on Memory Systems (MEMSYS 2016), October, 2016, Washington, DC, USA.
Link

Reverse Engineering of DRAMs: Row Hammer with Crosshair
M. Jung, C. Rheinländer, C. Weis, N. Wehn. International Symposium on Memory Systems (MEMSYS 2016), October, 2016, Washington, DC, USA.
Link

A New Bank Sensitive DRAMPower Model for Efficient Design Space Exploration
M. Jung, D. M. Mathew, É. F. Zulian, C. Weis, N. Wehn. International Workshop on Power and Timing Modeling, Optimization and Simulation (PATMOS 2016), September, 2016, Bremen, Germany.
PDF

Approximate Computing with Partially Unreliable Dynamic Random Access Memory: Approximate DRAM
M. Jung, D. M. Mathew, C. Weis, N. Wehn.In Proc. IEEE/ACM Design Automation Conference (DAC), June, 2016, Austin, TX, USA.

Error Resilience and Energy Efficiency: An LDPC Decoder Design Study
P. Schläfer, C. Huang, C. Schoeny, C. Weis, Y. Li, N. Wehn, L. Dolecek. IEEE Conference Design, Automation and Test in Europe (DATE), March, 2016, Dresden, Germany.

Efficient Reliability Management in SoCs - An Approximate DRAM Perspective
M. Jung, D. M. Mathew, C. Weis, N. Wehn. 21st Asia and South Pacific Design Automation Conference (ASP-DAC), Special Session: Cross-Layer Resilience: Snapshots from the Frontier of Design, January, 2016, Macao, China.

A Cross Layer Approach for Efficient Thermal Management in 3D Stacked SoCs
M. Jung, C. Weis, N. Wehn. Journal of Microelectronics Reliability, Elsevier 2015.
Link

Reliability and Thermal Challenges in 3D Integrated Embedded Systems
C. Weis, M. Jung, N. Wehn. 1st International ESWEEK Workshop on Resiliency in Embedded Electronic Systems, October, 2015, Amsterdam, The Netherlands.
Link

Omitting Refresh - A Case Study for Commodity and Wide I/O DRAMs
M. Jung, É. F. Zulian, D. M. Mathew, M. Herrmann, C. Brugger, C. Weis, N. Wehn. 1st International Symposium on Memory Systems (MEMSYS 2015), October, 2015, Washington, DC, USA.

University Of Kaiserslautern Releases DRAMSpec In Cooperation With ARM
O. Naji, C. Weis, M. Jung, N. Wehn, A. Hansson. HiPEAC info 44 (Page 9), October, 2015, www.hipeac.net.

DRAMSys: A flexible DRAM Subsystem Design Space Exploration Framework
M. Jung, C. Weis, N. Wehn. IPSJ Transactions on System LSI Design Methodology (T-SLDM), August, 2015.
Link

A High-Level DRAM Timing, Power and Area Exploration Tool
O. Naji, A. Hansson, C. Weis, M. Jung, N. Wehn. IEEE International Conference on Embedded Computer Systems Architectures Modeling and Simulation (SAMOS), July, 2015, Samos Island, Greece.
Link

A Custom Computing System for Finding Similarities in Complex Networks
C. Brugger, V. Grigorovici, M. Jung, C. Weis, C. De Schryver, K. Zweig, N. Wehn. Best Paper Award, IEEE Computer Society Annual Symposium on VLSI (ISVLSI), July, 2015, Montpellier, France.

Thermal Aspects and High-level Explorations of 3D stacked DRAMs
C. Weis, M. Jung, C. Santos, P. Vivet, O. Naji, A. Hansson, N. Wehn. IEEE Computer Society Annual Symposium on VLSI (ISVLSI), July, 2015, Montpellier, France.

A Cross Layer Reliability Approach for Efficient Thermal Management in 3D Stacked Wireless Baseband SoCs
M. Jung, C. Weis, N. Wehn. 8th International Conference on Materials for Advanced Technologies of the Materials Research Society of Singapore 2015 (ICMAT 2015) - Symposium on Reliability and Variability of Devices for Circuits and Systems (RV-DCS), June, 2015, Singapore, Singapore.

An Optimal Microarchitecture for Finding Similarities in Complex Networks Based on Optimal Memory Hierarchies
C. Brugger, V. Grigorovici, M. Jung, C. Weis, C. De Schryver, K. Zweig, N. Wehn. WIP, IEEE/ACM Design Automation Conference (DAC), June, 2015, San Francisco, CA, USA.

Application-aware Cross-Layer Reliability Analysis and Optimization
M. Glaß, H. Aliee, L. Chen, M. Ebrahimi, F. Khosravi, V. B. Kleeberger, A. Listl, D. Müller-Gritschneder, F. Oboril, U. Schlichtmann, M. B. Tahoori, J. Teich, N. Wehn, and C. Weis. it - Information Technology 57, issue 3 (2015), de Gruyter Oldenbourg, Germany, May, 2015.

Retention Time Measurements and Modelling of Bit Error Rates of WIDE-I/O DRAM in MPSoCs
C. Weis, M. Jung, P. Ehses, C. Santos, P. Vivet, S. Goossens, M. Koedam, N. Wehn. IEEE Conference Design, Automation and Test in Europe (DATE), March, 2015, Grenoble, France.

Circuit Resilience Roadmap
V. Kleeberger, C. Weis, U. Schlichtmann, N. Wehn. Chapter 7 in: Reis, Ricardo, Cao, Yu, Wirth, Gilson (Eds.): Circuit Design for Reliability, Springer, January, 2015.
p. 121-143, ISBN 978-1-4614-4078-9
Link

Optimized Active and Power-Down Mode Refresh Control in 3D-DRAMs
M. Jung, M. Sadri, C. Weis, N. Wehn, L. Benini. IFIP/IEEE International Conference on Very Large Scale Integration (VLSI-SoC), October, 2014, Playa del Carmen, Mexico.

Exploiting Expendable Process-Margins in DRAMs for Run-Time Performance Optimization
K. Chandrasekar, S. Goossens, C. Weis, M. Koedam, B. Akesson, N. Wehn, K. Goossens. IEEE Conference Design, Automation and Test in Europe (DATE), March, 2014, Dresden.

Energy Optimization in 3D MPSoCs with Wide-I/O DRAM
M. Sadri, M. Jung, C. Weis, N. Wehn, L. Benini. IEEE Conference Design, Automation and Test in Europe (DATE), March, 2014, Dresden.
Link

Hybrid Memory Architecture for Voltage Scaling in Ultra-Low-Power Multi-Core Biomedical Processors
D. Bortolotti, A. Bartolini, C. Weis, D. Rossi, L. Benini. IEEE Conference Design, Automation and Test in Europe (DATE), March, 2014, Dresden.

Resilience Articulation Point (RAP): Cross-layer Dependability Modeling for Nanometer System-on-chip Resilience
A. Herkersdorf, V. Kleeberger, S. Nassif, U. Schlichtmann, C. Gimmler-Dumont, C. Weis, N. Wehn, et. al. Journal of Microelectronics Reliability, Volume 54, Pages 1066-1074, ISSN 0026-2714, Elsevier 2014 , February, 2014.

Energy and Performance Exploration of Accelerator Coherency Port Using Xilinx ZYNQ
M. Sadri, C. Weis, N. Wehn, L. Benini. FPGAworld 2013, September, 2013, Copenhagen / Stockholm.

A Cross-Layer Technology-Based Study of the Impact of Memory Errors on System Resilience
V. Kleeberger, C. Gimmler-Dumont, C. Weis, A. Herkersdorf, S. Nassif, U. Schlichtmann, N. Wehn, Daniel Müller-Gritschneder. IEEE Micro, Vol. 33, no. 4, pp. 46-55, July, 2013.
Link

Towards Variation-Aware System-Level Power Estimation of DRAMs: An Empirical Approach
K. Chandrasekar, C. Weis, B. Akesson, N. Wehn, K. Goossens. In Proc. IEEE/ACM Design Automation Conference (DAC), June, 2013, Austin, TX, US.
Link

Power Modelling of 3D-Stacked Memories with TLM2.0 based Virtual Platforms
M. Jung, C. Weis, P. Bertram, G. Braun, N. Wehn. Synopsys User Group Conference (SNUG), May, 2013, Munich, Germany.
PDF

Exploration and Optimization of 3-D Integrated DRAM Subsystems
C. Weis, I. Loi, L. Benini, N. Wehn. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Vol. 32, Issue 4, Pages 597 - 610, April, 2013, New York, US.
Link

Cross-Layer Dependability Modeling and Abstraction in System on Chip
A. Herkersdorf, V. Kleeberger, S. Nassif, U. Schlichtmann, C. Weis, N. Wehn, et. al. 9th IEEE Workshop on Silicon Errors in Logic - System Effects (SELSE), March, 2013, Standford University.

System and Circuit Level Power Modeling of Energy-Efficient 3D-Stacked Wide I/O DRAMs
K. Chandrasekar, C. Weis, B. Akesson, N. Wehn, K. Goossens. In Proc. IEEE Conference Design, Automation and Test in Europe (DATE), March, 2013, Grenoble, France.

TLM Modelling of 3D Stacked Wide I/O DRAM Subsystems, A Virtual Platform for Memory Controller Design Space Exploration
M. Jung, C. Weis, N. Wehn, K. Chandrasekar. International Conference on High-Performance and Embedded Architectures and Compilers 2013 (HiPEAC), Workshop on: Rapid Simulation and Performance Evaluation: Methods and Tools (RAPIDO), January, 2013, Berlin.
Published by ACM New York, 2013, USA
Link

Modelling 3D-Stacked Memories with Virtual Platforms
M. Jung, C. Weis, N. Wehn. HiPEAC info 32 (Pages 12-13), www.hipeac.net, October, 2012.
Link

A 2.15GBit/s Turbo Code Decoder for LTE Advanced Base Station Applications
T. Ilnseher, F. Kienle, C. Weis, N. Wehn. 7th International Symposium on Turbo Codes & Iterative Information Processing, August, 2012, Gothenborg, Sweden.

Design Space of Flexible Multigigabit LDPC Decoders
P. Schläfer, M. Alles, C. Weis, N. Wehn. VLSI Design, vol. 2012, 10 pages, May, 2012.
Article ID 942893
Link

A High-Performance FPGA-Based Implementation of LZSS Compression Algorithm
I. Shcherbakov, C. Weis, N. Wehn. in Proceedings of IEEE Reconfigurable Architectures Workshop, May, 2012, Shanghai, China.

An Energy Efficient DRAM Subsystem for 3D integrated SoCs
C. Weis, I. Loi, N. Wehn, L. Benini. In Proc. IEEE Conference Design, Automation and Test in Europe (DATE), March, 2012, Dresden, Germany.
Link

DRAM Selection and Configuration for Real-Time Mobile Systems
M. Gomony, C. Weis, B. Akesson, N. Wehn, K. Goossens. In Proc. IEEE Conference Design, Automation and Test in Europe (DATE), March, 2012, Dresden, Germany.
Link

ASIC Design of a Gbit/s LDPC Decoder for Iterative MIMO Systems
C. Gimmler-Dumont, F. Kienle, C. Weis, N. Wehn, M. Alles. IEEE International Conference on Computing, Networking & Communications, January, 2012, Maui, Hawaii.
Link

Bringing C++ productivity to VHDL world: from language definition to a case study
I. Shcherbakov, C. Weis, N. Wehn. Forum on specification & Design Languages (FDL-2011), September, 2011, Oldenburg, Germany.
Link

Design Space Exploration for 3D-stacked DRAMs
C. Weis, I. Loi, N. Wehn, L. Benini. In Proc. IEEE Conference Design, Automation and Test in Europe (DATE), March, 2011, Grenoble, France.
Link