Fachgebiet Entwurf Mikroelektronischer Systeme (EMS)

Menbere Tekleyohannes, M.Sc.


Anschrift

Erwin-Schrödinger-Straße
Gebäude 12, Raum 228
67663 Kaiserslautern

Kontakt

Telefon: (+49) 631 / 205-4803
Fax: (+49) 631 / 205-4437
Email: tekley(at)eit.uni-kl.de

Forschungsgebiete

  • 3D-DRAM Scheduling
  • Bildverarbeitung

Publikationen

iDocChip: A Configurable Hardware Accelerator for an End-to-End Historical Document Image Processing
M. Tekleyohannes, V. Rybalkin, M. M. Ghaffar, J. Varela, N. Wehn, A. Dengel. Accepted for publication, MDPI Journal of Imaging, Special Issue: Image Processing Using FPGAs, 2021.

When massive GPU parallelism ain't enough: A Novel Hardware Architecture of 2D-LSTM Neural Network
V. Rybalkin, J. Ney, M. Tekleyohannes, M. M. Ghaffar, N. Wehn. Accepted for publication, ACM Journal Transactions on Reconfigurable Technology and Systems (TRETS), 2021.

iDocChip - A Configurable Hardware Architecture for Historical Document Image Processing: Multiresolution Morphology-based Text and Image Segmentation
M. Tekleyohannes, V. Rybalkin, M. M. Ghaffar, J. Varela, N. Wehn, A. Dengel. International Journal of Parallel Programming, Springer, 2021.
Link

iDocChip - A Configurable Hardware Architecture for Historical Document Image Processing: Text Line Extraction
M. Tekleyohannes, V. Rybalkin, S. S. Bukhari, M. M. Ghaffar, N. Wehn and A. Dengel. International Conference on Reconfigurable Computing and FPGAs (ReConFig 2019), December, 2019, Cancun, Mexico.

iDocChip - A Configurable Hardware Architecture for Historical Document Image Processing: Multiresolution Morphology-based Text and Image Segmentation
M. Tekleyohannes, V. Rybalkin, S. Bukhari, M. M. Ghaffar, J. Varela, N. Wehn, A. Dengel. International Embedded Systems Symposium (IESS 2019), September, 2019, Friedrichshafen, Germany.
Best Paper Award

A Reconfigurable Accelerator for Morphological Operations
M. Tekleyohannes, C. Weis, Norbert Wehn, M. Klein, M. Siegrist. IEEE International Parallel and Distributed Processing Symposium Workshops (IPDPSW)(RAW2018), May, 2018, Vancouver, Canada.

An Advanced Embedded Architecture for Connected Component Analysis in Industrial Applications
M. Tekleyohannes, M. Sadri, M. Klein, M. Siegrist, C. Weis, N. Wehn. IEEE Conference Design, Automation and Test in Europe (DATE), March, 2017, Lausanne, Switzerland.

Zum Seitenanfang